Subheading 8538.90
US HTSPrinted circuit assemblies of an article of heading 8537 for one of the articles described in additional U.S. note 12 to chapter 85
5 tariff lines
| HTS Code | Description | MFN Rate | Special |
|---|---|---|---|
| 8538.90.10 | Printed circuit assemblies of an article of heading 8537 for one of the articles described in additional U.S. note 12 to chapter 85 | Free | — |
| 8538.90.30 | Printed circuit assemblies, suitable for use solely or principally with the apparatus of heading 8535, 8536 or 8537, nesoi | 3.5% | Free (A*,AU,B,BH,CL,CO,D,E,IL,JO,JP,KR,MA,OM,P,PA,PE,S,SG) |
| 8538.90.40 | Parts for articles of 8535.90.40, 8536.30.40 or 8536.50.40, of ceramic or metallic materials, mech. or elec. reactive to changes in temp. | 3.5% | Free (A*,AU,B,BH,CL,CO,D,E,IL,JO,KR,MA,OM,P,PA,PE,S,SG) |
| 8538.90.60 | Molded parts nesoi, suitable for use solely or principally with the apparatus of heading 8535, 8536 or 8537 | 3.5% | Free (A*,AU,B,BH,CL,CO,D,E,IL,JO,JP,KR,MA,OM,P,PA,PE,S,SG) |
| 8538.90.81 | Other parts nesoi, suitable for use solely or principally with the apparatus of heading 8535, 8536 or 8537 | 3.5% | Free (A*,AU,B,BH,CL,CO,D,E,IL,JO,JP,KR,MA,OM,P,PA,PE,S,SG) |
Source: US International Trade Commission (USITC). For informational purposes only. Consult the official HTS and a licensed customs broker for binding rates.